HMC-C007

HMC-C007

Image is for reference, please contact us to get the real picture

Manufacturer Part HMC-C007
Manufacturer Linear Technology (Analog Devices, Inc.)
Description INGAP HBT DIVIDE-BY-8 MODULE 0.5
Category RF/IF and RFID
Family RF Misc ICs and Modules
Lifecycle: New from this manufacturer.
Delivery: DHL FedEx Ups TNT EMS
Payment T/T Paypal Visa MoneyGram Western Union
DataSheet HMC-C007 PDF

Availability

InStock 1,043,420
UnitPrice $ 2026.08000

HMC-C007 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com

HMC-C007 Specifications

Type Description
Series:-
Package:Bulk
Part Status:Last Time Buy
Function:Divide-by-8
Frequency:500MHz ~ 18GHz
RF Type:VSAT
Secondary Attributes:-
Mounting Type:Connector Mount
Package / Case:Module, SMA Connectors
Supplier Device Package:Module

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

Featured Products

Copyright © 2024 ZHONG HAI SHENG TECHNOLOGY LIMITED All Rights Reserved.

Privacy Statement | Terms Of Use | Quality Warranty

Top